By Mark Bown, Filtronic

Satellite communication (satcom) networks have become part of critical national infrastructure. As geopolitical uncertainty grows and global alliances shift, it’s never been more important for nations to take control of the satellite ecosystems their citizens and institutions depend on – from the hardware in orbit to the ground systems providing vital connections between Earth and space. 

Nationally important infrastructure 

Just like energy infrastructure, transport networks and IT systems, satcom networks are now regarded as critical national infrastructure. Satellite communications underpin vital systems that are critical for everyday life and national security – from mobile phone and broadband services to emergency response, defence and finance systems. That’s why governments need to ensure satellite networks are afforded the same levels of protection as other more visible national assets.

To achieve greater sovereignty in satellite communications, nations must invest in more than the satellites themselves and look to secure the systems and technologies that enable satellite connectivity – from radio frequency (RF) technologies and ground infrastructure to the supply chains that support them.

Connectivity for everyday life

The rapid growth of satellite constellations in very low earth orbit (VLEO), low earth orbit (LEO), medium earth orbit (MEO) and geostationary orbit (GEO) has transformed the capabilities of global communications networks – enabling continuous high-speed connectivity across the globe.

To deliver this essential satellite connectivity, nations have typically relied on technology and systems from a few global providers, or on sharing infrastructure and expertise with other nations. Recent global events, and the threats to critical infrastructure on multiple fronts, have brought into sharp focus the importance of gaining greater control over the critical satcom infrastructure we rely on every day, and reducing our dependence on third-party systems and expertise.

Vital role for ground segment

While attention might naturally focus on the satellites themselves and the associated launch assets, an often overlooked but fundamental part of any satellite network is the ground segment. Incorporating gateway infrastructure, teleports, high-capacity RF links, digital networks and associated data routing, this ground-based infrastructure connects communications networks on Earth with satellites in multiple orbits – ensuring seamless high-speed connectivity between space-based hardware and systems on the ground. Without a resilient, robust and widely distributed ground infrastructure, satcom networks simply cannot function.

Sovereignty means alliances, not isolation

To provide the continuous connectivity required for critical communications, all technologies and components within a satellite ecosystem need to be compatible and interoperable, as well as providing the redundancy needed to ensure uninterrupted operation. While sovereignty over these systems may be the goal, in reality no single nation can source all of the technology, materials and expertise required for such fully integrated systems from within its own borders.

For the UK, therefore, gaining sovereign control does not mean isolating ourselves from the rest of the world. Instead, it means working with trusted international partners to nurture secure and diversified satcom technology supply chains, supported by a select network of reliable specialist suppliers. At the same time, we must continue to advance our own domestic expertise and capabilities so we can extend our control over the mission-critical elements of satcom networks.

Advancing domestic capability

Filtronic has been leading the way in developing advanced RF technologies for satellite communications for many years, developing solutions to maximise bandwidth and enable efficient, resilient, high-speed data communications.

Filtronic expertise has enhanced the performance of many enabling technologies for the satellite ground segment, including solid-state power amplifiers, transmit and receive devices, block upconverters, downconverters and filters, and we’ve introduced high-performance semiconductor compounds, such as gallium nitride (GaN), to improve the power and efficiency of satcom devices. We’ve also developed space-qualified modules, supporting high-bandwidth inter-satellite, direct-to device and satellite-to Earth communications.

Making space for more data

To expand the capacity of satellite networks in line with accelerating data usage, Filtronic has led the satcom sector into higher frequency mmWave bands, such as Q, V and E bands. Moving into these lesser-used frequencies gives satellite companies the opportunity to establish high-quality, ultra-fast communications channels, enabling high-speed data exchange between satellites and ground stations, as well as between satellites within constellations.

On the ground, digitalisation is shifting communications into RF-over-IP networks, which simplify ground infrastructure and enable greater volumes of data to be transmitted securely and reliably. Digitalisation will mean future satellite ground architectures are increasingly software-defined and widely distributed, and Filtronic is supporting this move in the UK by developing new digitiser/de-digitiser technology to toggle signals between analogue and IP formats.

Security begins at home

As the UK seeks to achieve greater control over its national satcom networks, the UK-based design, manufacturing and engineering expertise offered by Filtronic becomes an increasingly important strategic asset. In an uncertain world, our skills and capabilities – allied with crucial technologies and systems sourced from trusted global partners – offer a clear route to greater sovereignty, resilience and security for the UK’s critical satcom infrastructure.

For more information about the latest developments in RF satcom technologies, please visit our website or speak to a member of our team on +44 (0)1740 618 800.

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By Dr Tudor Williams, Chief Technology Officer, Filtronic

In a world of volatile geopolitics, ever-shifting conflicts and new adversaries, nations need to gain control of the highly contested electromagnetic spectrum to secure their critical defence systems. The solution to fast, reliable, controllable battlespace communications lies in shifting upwards into uncongested mmWave frequencies – but can RF technology keep pace with this urgent demand? 

The electromagnetic spectrum has become a critical, invisible domain in modern warfare, used for communication, navigation and surveillance activities as well as for offensive and defensive electronic warfare (EW). Reliable communications have become a precondition of effective warfare, with electromagnetic spectrum dominance now as important as air or land superiority. Battlefield communications need to be protected from interception, disruption or exploitation if forces are to maintain operational security, command continuity and operational effectiveness.

Critical role of data in modern battlefield operations

Battlefield participants rely on the electromagnetic spectrum across widely distributed operations and sensor networks to inform and support real-time decision-making. There has been a huge expansion of data requirements on the battlefield, from electronic attack (EA) jamming and spoofing systems to disrupt radar, communications and drone operations, through to electronic protection (EP) systems to secure friendly assets against such attacks. Electronic warfare support (ES) systems harness the electromagnetic spectrum to detect, locate and identify enemy radio emissions and radar systems, using complex Intelligence, Surveillance and Reconnaissance (ISR) and Signals Intelligence (SIGINT) systems to inform tactical decisions.

The electromagnetic spectrum is also used in radar and sensing systems, for target acquisition, battlefield management and fire control. All of these applications require high-capacity tactical and backhaul connections to ensure data is delivered rapidly and reliably in hostile situations.

Problems of a congested spectrum

This proliferation of defence sector applications is occurring alongside exponential growth in the use of same electromagnetic spectrum for increasingly complex commercial and civilian applications – from terrestrial broadband to satellite communications. All of which means the finite electromagnetic spectrum is becoming highly congested, particularly at frequencies below 40GHz.

The growth in demand for bandwidth is leading to greater problems with interference, both intentional and unintentional. Signals in congested frequency bands can accidentally interfere with each other, and signals at lower frequencies are more easily detectable and susceptible to electronic attack, jamming and spoofing, reducing their safety and reliability in battlefield scenarios.

Rising above the noise

As growing demand for bandwidth coincides with shrinking availability within the usable electromagnetic spectrum, defence applications need to shift into higher frequencies in the lesser-used mmWave bands (Q, V, E and W), where wide areas of uncongested bandwidth are available. Developing RF amplifiers, transmit and receive devices and other critical RF front end components is considerably more challenging in the mmWave spectrum, but Filtronic is leading the way into these higher frequencies with defence-proven technologies designed to perform in the harshest environments.

What are the advantages of mmWave?

The move upwards into mmWave offers multiple benefits for defence applications. mmWave frequencies are well suited to high-capacity  applications, secure point-to-point links and sensing applications in contested battlespaces. Crucially, signals at mmWave are highly directional, leading to a lower probability of interception (LPI) and lower probability of detection (LPD). Signals are filtered spatially too, providing natural mitigation against interference.

The “pencil beam” signals at mmWave are contained within a specific, narrow path between transmitter and receiver, making them difficult to intercept or trace. Beam agility and adaptive links at mmWave provide steerable, highly focused and responsive wireless signals, and enable high-speed real-time tracking of moving devices, such as drones.

Ultimately, shifting battlefield communications and electronic warfare applications into mmWave frequencies facilitates far more secure, resilient and reliable communications in adverse and denied environments.

Technology challenges of mmWave

While mmWave offers the scope to support next-generation defence applications, moving up the frequency spectrum presents significant challenges for technology developers. Designing and manufacturing transmit and receive devices, filters and amplifiers becomes more complex at higher frequencies because tolerances are much higher. The smaller size of components involved also means that machining and part placement become more intricate.

Transmit and receive functions at this level must incorporate tightly packed semiconductor components, presenting challenges for thermal management and packaging. At higher frequencies, it also becomes more difficult to manufacture devices consistently at scale.

Intelligent UK design, manufacture and innovation, enabling technology independence

At Filtronic, we have been pushing the boundaries of RF technology for almost 50 years and now lead the market in high-frequency, high-capacity, high-power mmWave solutions. We collaborate and innovate with the defence sector, designing and manufacturing advanced mmWave components, from complex filters, transceivers and SSPAs to integrated transmit-and-receive modules (TRMs), for today’s sophisticated electronic warfare systems.

Our vertically integrated structure means that every stage of the process, from initial chip design and MMIC development through to manufacturing, assembly and testing, is conducted within our own security-cleared facilities – all located in the UK. Our manufacturing capabilities allow us to rapidly develop products from early Technology Readiness Level (TRL) prototypes through to high-volume production in the same state-of-the-art facility.

That means we can help our defence clients deploy game-changing new mmWave technologies at speed and scale. By enabling defence forces to gain superiority in the contested electromagnetic spectrum, we are enhancing the performance, reliability and security of modern battlefield systems, and mitigating risks to operations and personnel.

Filtronic Chief Technology Officer Tudor Williams will be giving a talk on Contested Spectrum, Covert Advantage at the AOC Europe Symposium and Convention in Helsinki, Finland from 19-21 May 2026. You can also meet our experts on the Filtronic stand at Booth 4G32.

For more information about our range of mmWave technologies, please visit our website or speak to a member of our team on +44 (0)1740 618 800.

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By Nima Razavi-Ghods, Head of System Engineering, Filtronic

Digital Intermediate Frequency Interoperability (DIFI) is key to the future of a lean, efficient and agile satellite communications ground segment. Filtronic is developing high-throughput, high-bandwidth devices to digitise and de-digitise signals – supporting the industry-wide shift to virtualised satcom infrastructure.

Digital Intermediate Frequency (DIF) or ‘RF over IP’ technology offers the opportunity for satellite data communications to scale up rapidly and cost-effectively, while preserving signal quality and improving resilience in the face of growing demand for data.

By encoding analogue radio frequency (RF) signals into standard Internet Protocol (IP) packets, data can be transported more reliably and securely, at scale and with minimal signal degradation even over long distances. In a digitised system, analogue RF signals are encapsulated as IP packets at source and transmitted over an Ethernet connection to the antenna station. There, signals are reconstructed back into RF upconverted to the required frequency, and amplified for transmission via the antenna to satellites.

Advantages of digital over analogue RF systems

Crucially, digitising signals at source and converting them back close to the antenna eliminates a whole swathe of analogue hardware, terminal building infrastructure and cabling currently used to process signals at the antenna station. This reduces capex and makes installation far simpler. There is no need for physical baseband modems, IF matrices or IF/RF cross-site cabling, and some elements of up and down conversion can also be eliminated. In practice, much of this terminal building infrastructure can be replaced by a single digitiser/de-digitiser located close to the antenna, alongside existing upconverters and downconverters. 

By digitising signals at source and de-digitising them close to the antenna, signal quality can be maintained and losses in transmission significantly reduced. Analogue signals carried by coaxial cable are also more susceptible to interception, so moving to RF over IP using Ethernet cables also improves data security.

In a digitised system, more aspects of signal transmission can be managed by software, rather than hardware, making them easier to implement and upgrade. This enables traditional RF systems to be integrated into modern digital infrastructures, marking a major step forward in satcom technology.

Why is digitisation needed in satcom?

The continued exponential growth in data traffic means satellite communications must transition to DIFI to increase capacity, resilience and security. Fast-growing demand for data has seen the rapid expansion of LEO satellite constellations and high-throughput satellites (HTS) to deliver the necessary high-speed, high-capacity connectivity for advanced non-terrestrial networks of the future.

However, current analogue ground systems are struggling to keep pace and cannot be scaled quickly enough to meet future demand. These legacy hardware-heavy ground architectures are reaching their limits in terms of bandwidth, cost, capacity, scalability and flexibility. Transforming to digital infrastructure and transitioning towards higher frequencies solves these issues and enables satcom operators to rapidly and cost-effectively scale up their operations.

DIFI delivers capex and opex savings

The wholesale removal of hardware at satellite antenna sites translates to significantly lower capital expenditure when developing new ground-segment infrastructure, as well as reducing deployment times for these new assets.

Digitised infrastructure requires fewer hardware components, fewer cables and no terminal building, which equates to much lower operating and maintenance costs. Installation is much simpler and less costly too.

Existing antenna sites can be upgraded for DIFI operation, saving operating expenditure on maintaining legacy hardware and cabling, and eliminating building maintenance or rental costs. In fact, the operational savings made can easily fund the conversion of existing sites to DIFI.

High-throughput, high-bandwidth solution from Filtronic

As a leading innovator in satcom RF technology, Filtronic is developing an advanced digitiser/de-digitiser to open the door to DIFI for satellite ground operations. By combining digitising and de-digitising functions in one unit, our device provides a compact solution that can be deployed both at antenna sites to toggle signals between analogue and IP formats, and at data sources on the ground to encapsulate RF signals as IP packets prior to transmission.

What sets our new device apart is the combination of wide bandwidth and high channel count. Each of its six Tx/Rx channels supports bandwidths of up to 2.5 GHz on carriers of up to 7GHz. The hardware has also been designed with a modular architecture, allowing it to be tailored to specific frequency bands, and where required, to incorporate up/down conversion within the unit itself.

The combination of multi-channel flexibility, high throughput and modular versatility makes this device more capable than any other on the market – ready to support complex, high-bandwidth satcom architectures.

As a member of the DIFI consortium, Filtronic has been closely involved with the evolution of the standard,  which is poised to be adopted by all vendors, operators and users, and will be the key to achieving industry-wide interoperability across all hardware in the satcom ground segment market.

Future-proofing products for satcom digitization

The shift to Digital IF is fast approaching. Satcom suppliers need to prepare now to future-proof their products for an increasingly digitised satcom environment. Every component, from solid-state power amplifiers and block upconverters to channelisers and digitisers will need to have built-in capability to interface with the DIFI ecosystem, enabling seamless interoperability across the wider satcom network.

Filtronic is well advanced on this journey. Our new digitiser/de-digitiser is on target for launch in 2026, providing unmatched levels of flexibility, throughput and bandwidth to meet the demands of an increasingly virtualised satellite communications environment.

To find out more about our DIFI technology, please contact Filtronic – [email protected]

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By Laurence Scullion, Director of Production Engineering, Filtronic

As many communications applications move into mmWave frequencies to access greater bandwidth and data capacity – the challenge of designing and manufacturing modules to transmit, receive and condition signals increases significantly. The ability to design modules for manufacturability is critical, and process optimisation is key to achieving repeatability and scalability in production.

When you’re manufacturing modules for mmWave frequencies, the slightest mechanical, electrical or production variations can have significant impacts on performance. Any tolerance deviations are amplified at these frequencies, due to the intricate interplay of multiple components within the module.

The mechanical and electrical design challenges at mmWave are well recognised, from tolerance alignment, material selection (CTE matching), connector interfaces and enclosure sealing to transmission line geometries and electromagnetic simulation. What is perhaps less well understood is the challenge of bringing these designs to fruition in the manufacturing plant, taking complex, intricate module designs from the drawing board into consistent and efficient production at scale.

Bridging the gap from design to production

This ‘process optimisation’ is often the unseen element in the design-to-manufacturing process, but is critical in bringing advanced new systems to the market. In practical terms, it involves detailed process engineering to optimise every element of module production, from epoxy dispensing and placement automation to fixture alignment, inspection and measurement.

With our vertical integration of design, manufacturing and testing, Filtronic has established a leading position as a design-for-manufacturability specialist. Crucially, our ability to use process engineering to bridge the gap between design and scalable manufacturing, spanning Technology Readiness Levels (TRL) 6 to 9, has enabled us to deliver innovative new products at mmWave using the latest semiconductor technologies.

Revolutionising GaN-based power amplifiers

These capabilities have proved key to revolutionising the development of power amplifiers for higher mmWave frequencies, using gallium nitride (GaN) MMICs to achieve considerable power and efficiency gains.

GaN has become increasingly important as a semiconductor compound in recent years, delivering significantly improved power density and efficiency at mmWave, and unlocking the size, weight and power (SWAP) gains that are critically important for many space, defence, and aerospace applications. But GaN brings with it new complexities for design, manufacturing and operation. One acute problem associated with developing smaller modules with greater power density is managing and dissipating heat within the module. This calls for advanced packaging solutions.

Packaging challenges for high-power modules

The successful use of GaN in power amplifiers for mmWave applications relies on optimising the module packaging. The key challenges associated with packaging for GaN power amplifiers are:

• Thermal dissipation – managing high heat within the device at high power levels. GaN chip junction temperatures can reach 300°C.

• Reliability – ensuring reliable high-frequency operation in extreme environments. This requires radiation-hardened and defence-compliant devices.

• Scalability – moving from prototype laboratory models to mass production. This demands repeatable assembly and alignment techniques.

• Sovereign control – achieving security and supply chain assurances against a backdrop of limited UK supply chains for high-reliability packaging.

• High-frequency performance (30GHz+) – achieving the required performance given the technical limitations on die-attach options and interconnections at mmWave.

Plotting a path to optimal packaging

Filtronic is addressing these challenges by exploring a variety of advanced packaging methodologies for GaN-based mmWave power amplifiers. Our rigorous approach to process optimisation means we have devised and tested multiple solutions, enabling us to deploy the right techniques to solve the challenges of specific applications in different sectors. The options we have explored to overcome specific packaging challenges include:

• Advanced materials and die-attach options

We have created innovative thermal interfaces using die-attach materials such as sintered silver (Ag) to provide high thermal conductivity (~250 W/m·K), reliable void-free bonding and low-temperature sintering (<300°C). Eutectic gold-tin (AuSn) is another die-attach option, providing high reliability and proven performance in defence and space applications.

• Next-generation substrates and interconnects

Copper-tungsten (CuW) or copper-moly (CuMo) substrates are a close match to the CTE of GaN, reducing thermal stresses and enhancing mechanical robustness. Aluminium nitride (AlN) substrates also offer high thermal conductivity combined with electrical insulation for heat dissipation and heat soaking. To optimise precision-engineered interconnects we use wire bonding to minimise losses.

• Hermetic packaging

To achieve airtight and moisture-tight packaging, we have used low-loss, high-Q ceramic or metal-based packaging, as well as advanced new 3D plastic packaging for GaN devices.

Introducing the Prometheus V-band power amplifier

We have applied all of our process engineering and design-for-manufacturability expertise to develop an advanced new solid-state power amplifier (SSPA) for V-band (49-52GHz), using GaN MMICs. The new Prometheus SSPA is a complete, integrated platform, combining GaN semiconductor technology with our proven Cerus 32 SSPAs, packaged and ready for deployment in high-frequency applications. These amplifiers are to be plugged into ground communication systems for outdoor and indoor configurations and intended for harsh environment such as space or defence installations.

Prometheus incorporates the optimum combination of materials and advanced packaging techniques to maximise the power and efficiency benefits of GaN. Engineered for performance, resilience and long-term reliability in challenging environments, Prometheus answers the need for improved signal amplification and enhanced linear power at mmWave.

The development of Prometheus is a result of the focused work of our recently opened system development hub in Cambridge, combined with our growing GaN expertise and the alignment of our design teams with our precision manufacturing operations. It is a testament to our proficiency in the art of optimising processes to deliver complex mmWave systems consistently at scale.

If you’re looking to increase manufacturing yields for mmWave devices or improve system reliability in the field, we’d be delighted to talk to you about process optimisation. Please contact a member of our team on +44 (0)1740 618 800 or visit our website to find out more.

You can find out more about Prometheus here and explore our Cerus range of SSPAs here.

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