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Wire Bonding

Filtronics wire bonding capabilities include fully automated ball bond, manual wedge bond and manual ribbon bond.

Filtronics team of highly trained and experienced wire bond operators ensure that all work is carried out to the highest standard. Robust & reliable wire bond process capabilities are developed by optimising and tightly controlling the key wire bond process and material parameters. Ball shear and wire pull test are used as tools to qualify and centre the process. Sample ball shear and pull test are then used during manufacture in order to maintain high levels of quality & yield

Filtronics wire bond equipment is suitable for deep access multi-level operation and uses gold wire to form bonds between components, typical wire sizes are between 17.5 - 33 microns.

In-house programming capability and process engineering support.