Air Cavity Package
Filtronic is able to mix GaAs, GaN and Silicon die in a single package offering unprecedented integration and system cost savings.
To meet increasing demands for integration and cost reduction, Filtronic has developed a range of proprietary MMICs which are packaged in miniature surface mount multichip modules enabling manufacture in mass SMT lines. A major application is for the latest generation of PTP radios in the 4-42GHz band. As these packages minimise interconnects, the highest level of performance is achieved.